Surface Mount Adhesive edf 10cc Yellow
The D77 is a Yellow Surface Mount Adhesive used to attach chip resistors, Caps and other electrical components to Printed Circuit Boards. This adhesive holds the components in place through the wave soldering operation. It cures in an oven from 100C to 160C in as little as 3 minutes. It is yellow for good visibility against most solder masks and is dispensable in nice "Hershey Kiss" shaped dots. It is in a syringe from EFD, so it fits perfectly into the Asymtek, Camalot, Creative Automation, Universal GDM and many other dispensers.
Good dispensing Performance
Low Susceptibility to Moisture Absorption
Wide Process Window
Exceptional Adhesion Properties
Resistant to Internal Void Formation
Proprietary filling means true void free packaging (No skips)
Pb Free or Sn/Pb process compatible
Good dispensing Performance
Low Susceptibility to Moisture Absorption
Wide Process Window
Exceptional Adhesion Properties
Resistant to Internal Void Formation
Proprietary filling means true void free packaging (No skips)
Pb Free or Sn/Pb process compatible
Surface Mount Adhesive edf 30cc Red
The D77 is a Surface Mount Adhesive used to attach chip resistors, Caps and other electrical components to Printed Circuit Boards. This adhesive holds the components in place through the wave soldering operation. It cures in an oven from 100C to 160C in as little as 3 minutes. It is red for good visibility against most solder masks and is dispensable in nice "Hershey Kiss" shaped dots. It is in a syringe from EFD, so it fits perfectly into the Asymtek, Camalot, Creative Automation, Universal GDM and many other dispensers.
Good dispensing Performance
Low Susceptibility to Moisture Absorption
Wide Process Window
Exceptional Adhesion Properties
Resistant to Internal Void Formation
Proprietary filling means true void free packaging (No skips)
Pb Free or Sn/Pb process compatible
Good dispensing Performance
Low Susceptibility to Moisture Absorption
Wide Process Window
Exceptional Adhesion Properties
Resistant to Internal Void Formation
Proprietary filling means true void free packaging (No skips)
Pb Free or Sn/Pb process compatible
Our price: $32.00
Surface Mount Adhesive Fuji GL Red
The D77 is a Surface Mount Adhesive used to attach chip resistors, Caps and other electrical components to Printed Circuit Boards. This adhesive holds the components in place through the wave soldering operation. It cures in an oven from 100C to 160C in as little as 3 minutes. It is red for good visibility against most solder masks and is dispensable in nice "Hershey Kiss" shaped dots. It is in a syringe from Fuji, so it fits perfectly into the Fuji GL series dispensers.
Good dispensing Performance
Low Susceptibility to Moisture Absorption
Wide Process Window
Exceptional Adhesion Properties
Resistant to Internal Void Formation
Proprietary filling means true void free packaging (No skips)
Pb Free or Sn/Pb process compatible
Good dispensing Performance
Low Susceptibility to Moisture Absorption
Wide Process Window
Exceptional Adhesion Properties
Resistant to Internal Void Formation
Proprietary filling means true void free packaging (No skips)
Pb Free or Sn/Pb process compatible
Surface Mount Adhesive edf 10cc Red
The D77 is a Surface Mount Adhesive used to attach chip resistors, Caps and other electrical components to Printed Circuit Boards. This adhesive holds the components in place through the wave soldering operation. It cures in an oven from 100C to 160C in as little as 3 minutes. It is red for good visibility against most solder masks and is dispensable in nice "Hershey Kiss" shaped dots. It is in a syringe from EFD, so it fits perfectly into the Asymtek, Camalot, Creative Automation, Universal GDM and many other dispensers.
Good dispensing Performance
Low Susceptibility to Moisture Absorption
Wide Process Window
Exceptional Adhesion Properties
Resistant to Internal Void Formation
Proprietary filling means true void free packaging (No skips)
Pb Free or Sn/Pb process compatible
Good dispensing Performance
Low Susceptibility to Moisture Absorption
Wide Process Window
Exceptional Adhesion Properties
Resistant to Internal Void Formation
Proprietary filling means true void free packaging (No skips)
Pb Free or Sn/Pb process compatible
