No-Clean Rework Flux
OCI NCRF-420 No-Clean Rework Flux – 10 cc Syringe. Designed for electronic assembly repair. Optimized for BGA, MicroBGA, and other small features. This is a 10cc syringe for use with air-powered dispenser.
Unlike liquid fluxes this is a high tack flux that stays where you dispense it. It is ideal for holding components while re soldering them with a soldering iron or a hot plate. It is the ideal way to reattach BGAs and other area array packages. This “No-Clean” paste flux reflows into a hard residue that does not need to be cleaned off the board. It acts like a conformal coating and is totally non-conductive and non-reactive after reflow.
It is the ideal choice for QFP or BGA rework operations. It is also well suited for use with through-hole repair operations. Residues that remain after soldering are almost colorless, leaving a cosmetically appealing repair. The residue has high electrical resistance is safe to be left on the assembly after soldering.
Features:
- High tack means it stays in place during rework
- Residues are totally inert – no need to remove them
- Compatible with all standard fluxes.
- Helps achieve a perfect shiny solder joints
- Lead Free SAC305, Tin Lead 63/37 and most other solders – OK
- Stored at room temperature.