Why does this site exist?
Over 25 years ago I became interested in dispensing. I made Surface Mount Adhesive, solder paste, epoxies, fluxes, dam and fill materials and other materials for dispensing. I also sold dispensers and ran the groups that developed, made and serviced them.
Over this time I learned a lot of details and topics that made dispensing work. There is no book, no course on it. It is a topic people "pick up"
This web site has a lot of that type of information. It is not difficult to grasp, just difficult to find, until now
With this web site, you have a collection of information that spells it out, in plain English. Where I have a product with an advantage - I offer it. Where I don't, I try to point you to the place that does.
I hope this site makes dispensing easier and more productive for you. If you have a better way to explain something, tell me. If you want to know something - ask. I hope this will be a growing site and I hope you enjoy it
The Debate about Surface Mount Sealing Systems, Sept/Oct issue, 2003, Gasses and Technology
Invited to author this as a guest contributor by the editor. It was a controversial topic with political overtones between Applied Materials and Fujiken
Surface Mount Council Eyes Optoelectronics, Frank Murch, document.write(get_publication('EP&P')); EP&P, 8/1/2001
At the time Optoelectronics was extremely “hot” and it lacked assembly methods. The concept was that semiconductor fabrication methods could be reapplied to this technology
SMT Adhesives: Evaluating Critical Parameters, Universal Instruments August 97, Portland SMTA
Managing CSP underfill processes: the inherent slowness of underfill flowout can be masked to improve throughput. (Dispensing) Circuits Assembly 2002
Dispensing Pump and Jet Design, Frank Murch, Director of Marketing for Asymtek, Sept 25 IEEE San Diego
High Speed Surface Mount Adhesives and Dispensing: Problems and SolutionsNepcon 1998.
This was based off and contributed to 3 programs to help manufacturers develop formulations to fit the dispenser. Loctite in the UK, Heraeus in Germany and the USA, and E&C in the US. These efforts linked through the loan of a machine and specific project goals
Issues for Practical Selecting and Dispensing of Adhesives. Indiana SMTA 1997
Practical Issues Concerning End Effectors, Universal Instruments, 1997 Dixon (US)
This was based off the development of an auger pump and a piston pump offering at Universal Instruments. It was backed up with a $150,000 development effort.
Kleber-Dosierverfahren in Theorie und Praxis,Productronic October 1997 (Germany)
Frequently Asked Questions about DispensingUniversal Instruments April 1998 (Privately published and distributed – About 20,000 copies) (US)
This was a sales and technical service effort directed at dispensing users, it was about 50 pages long and turned out to be very popular
Developing Windows Applications for Japan, International Journal of Computer Applications Technology (IJCAT) Jan? 1995 (UK)
Asian Input Methods, Multilingual ComputingVolume 6, Issue 2, 1995
The Morphology of Solder Paste (Understanding the composition of the no-cleans can help realize the full benefits of CFC elimination) Surface Mount Technology June 1992
Advances in Surface Mount Adhesives and Application TechnologiesNEPCON 97
Practical Issues Concerning Dispensing Pump TechnologiesCircuits Assembly 1997
Eliminating CFC Cleaning Solvents, Circuits Assembly, June 1993 (US)
How to Select Your Agents(US Department of Commerce Seminar Series), June 1991
Alternatives to CFC Solvent Cleanable Solder PastesSMTA 11/1991
Thick Film Materials for Chip Resistors, Proceedings of the 6th International Microelectronics Conference May 1990
新窒素抵抗ｼｽﾃﾑ､Advanced Hybrid Technology, 電子材料 5/1989
Practical Tips for Adhesives Evaluations, SMT July 1997
Iwashita Engineering Japan has provided some photos for this site